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Reflexlichtschranke mit VCSEL-Sender Reflective Interrupter with VCSEL-Emitter Lead (Pb) Free Product - RoHS Compliant SFH 9210
Wesentliche Merkmale * Groer Arbeitsabstand (2-10mm) * IR-GaAs-VCSEL (Vertical Cavity Surface Emitting Laser)in Kombination mit einem Si-NPN-Fototransistor * Enge Strahlverteilung des Senders * Tageslichtsperrfilter Anwendungen * * * * Positionssensor Endabschaltung Drehzahluberwachung, -regelung Bewegungssensor
Features * Long operating distance (2-10mm) * IR-GaAs-VCSEL (Vertical Cavity Surface Emitting Laser) in combination with a Silicon NPN phototransistor * Narrow beam characteristics of the emitter * Daylight cut-off filter Applications * * * * Position sensor End position switch Speed monitoring and regulating Motion sensor
Typ Type SFH 9210
Bestellnummer Ordering Code Q65110A2713
ICE [mA] (IF = 8 mA, VCE = 5 V, d = 5 mm)
(see note on page 5) 1 .... 8
Beim Betrieb dieses Bauteils sind die Sicherheitsvorschriften fur die Laserklasse 1M nach IEC 60825-1 Am. 2 zu beachten. Operating this device the safety instructions for laser class 1M according to IEC 60825-1 Am. 2 have to be observed.
ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device
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1
SFH 9210
Grenzwerte Maximum Ratings Bezeichnung Parameter Sender (GaAs-VCSEL-Diode) Emitter (GaAs VCSEL diode) Sperrspannung Reverse voltage Vorwartsgleichstrom Forward current Verlustleistung Power dissipation Empfanger (Si-Fototransistor) Detector (silicon phototransistor) Dauer-Kollektor-Emitter-Sperrspannung Continuous collector-emitter voltage Kollektor-Emitter-Sperrspannung, (t 2 min) Collector-emitter voltage, (t 2 min) Emitter-Kollektor-Sperrspannung Emitter-collector voltage Kollektorstrom Collector current Verlustleistung Total power dissipation Reflexlichtschranke Reflective Interrupter Lagertemperatur Storage temperature range Betriebstemperatur Operating temperature range Elektrostatische Entladung Electrostatic discharge
Umweltbedingungen / Environment conditions
Symbol Symbol
Wert Value
Einheit Unit
VR IF Ptot
3 10 25
V mA mW
VCE VCE VEC IC Ptot
16 30 7 20 100
V
mA mW
Tstg TOP
ESD
- 40 ... + 85 - 40 ... + 85 400
C
V
3 K3 acc. to EN 60721-3-3 (IEC 721-3-3)
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SFH 9210
Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Sender (GaAs-VCSEL-Diode) Emitter (GaAs-VCSEL diode) Wellenlange der Strahlung Wavelength at peak emission IF = 8 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 8 mA Schwellenstrom1) Threshold current1) Durchlaspannung Forward voltage IF = 10 mA Sperrstrom Reverse current VR = 3 V Kapazitat Capacitance VR = 0 V, f = 1 MHz Warmewiderstand2) Thermal resistance2) Empfanger (Si-Fototransistor) Detector (silicon phototransistor) Kapazitat Capacitance VCE = 5 V, f = 1 MHz Kollektor-Emitter-Reststrom Collector-emitter leakage current VCE = 20 V Fotostrom (Fremdlichtempfindlichkeit) Photocurrent (outside light density) VCE = 5 V, EV = 1000 Lx Warmewiderstand2) Thermal resistance2) peak 850 nm Symbol Symbol Wert Value Einheit Unit
1
nm
Ith VF
2.6 (<5) 1.8 ( 2.3)
mA V
IR
0.01 ( 1)
A
CO
25
pF
RthJA
1200
K/W
CCE
10
pF
ICEO
3 ( 200)
nA
IP
3.5
mA
RthJA
270
K/W
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SFH 9210
Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Reflexlichtschranke Reflective Interrupter Kollektor-Emitterstrom Collector-emitter current Kodak neutral white test card, 90% Reflexion IF = 8 mA; VCE = 5 V; d = 5 mm (see note on page 5) Symbol Symbol Wert Value Einheit Unit
ICE3)
-1 -2 -3 -4
1
... 8
mA
1 ... 2 1.6 ... 3.2 2.5 ... 5 4 ... 8 0.15 ( 0.6) V
VCE sat Kollektor-Emitter-Sattigungsspannung Collector-emitter-saturation voltage Kodak neutral white test card, 90% Reflexion IF = 8 mA; d = 5 mm; IC = 0.3 x ICE min. (see note on page 5)
1)
Der VCSEL emittiert nur bei Flussstromen groer als Ith VCSEL only emits at forward currents higher than Ith
2)
Montage auf PC-Board mit > 5 mm2 Padgroe Mounting on pcb with > 5 mm2 pad size
3)
Nur eine Gruppe innerhalb einer Verpackungseinheit. Bezug von Einzelgruppen ist nicht moglich. Only single group within one packing unit. Single bins can not be ordered.
d Reflector with 90% reflexion (Kodak neutral white test card)
OHM02257
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SFH 9210
Schaltzeiten (TA = 25 C, VCC = 5 V, IC = 1 mA1), RL = 1 k) Switching Times
F
RL VCC Output
C
OHM02258
Bezeichnung Parameter Einschaltzeit Turn-on time Anstiegzeit Rise time Ausschaltzeit Turn-off time Abfallzeit Fall time
1)
Symbol Symbol
Wert Value 65 50 55 50
Einheit Unit s s s s
tein ton tr taus toff tf
IC eingestellt uber den Durchlassstrom der Sendediode, den Reflexionsgrad und den Abstand des Reflektors vom Bauteil (d) IC as a function of the forward current of the emitting diode, the degree of reflection and the distance between reflector and component (d)
Anm.:- Es wird empfohlen die Lichtschranke bei dem spezifizierten Arbeitpunkt von ca. 8mA fur den Emitter
einzusetzten, weil andere Betriebsstrome zu einem groeren Streubereich beim Koppelfaktor fuhren. Der Abgleich erfolgt uber den Arbeitswiderstand am Detektor. Von einem Einsatz der Lichtschranke mit glanzenden oder gar spiegelnden Oberflachen wird abgeraten. Die Abstrahlcharakteristik des Senders andert sich sowohl uber die Temperatur als auch mit dem Flustrom starker als bei Standardemittern und fuhrt somit ebenfalls zur Erhohung des Streubereichs beim Koppelfaktor. Bei diffuser Streuung ist dieser Einflu jedoch gering, und kann fur die meisten Anwendungen vernachlassigt werden.
Note:
It is recomended to use the interrupter at the specified emitter current of about 8mA, as other operating currents lead to a larger coupling factor variation. The tuning is done using the operating resistor on the detector side. It is not recomended to use the interrupter in combination with shiny or mirror like surfaces. Changes in temperatures and operating current are having a bigger influence on the radiation characteristic as it is the case for standard emitters. This means a higher variance of the coupling factor. For diffuse surfaces the mentioned influence is low, and can be neglected for most of the applications.
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SFH 9210
CCollector Current --------I Cmax Kodak 90%
I
= f(d)
Switching Characteristics t = f (RL) TA = 25 C, IF = 8 mA
10 3 t
OHO00785
Transistor Capacitance (typ.) CCE = f (VCE), TA = 25 C, f = 1 MHz
50 pF
OHO00374
1.2 I C;rel 1.0 0.8 0.6 0.4 0.2 0.0 0 5 10 15 mm 20 d
s
C = 100 A
t on t off
C CE 40 35 30 25
10 2 t on t off
20 15 10 5
C = 1 mA
10
1
0
10 0 k RL 10 1
10 -1
10 -2
10 -1
10 0
10 1 V VCE
10 2
Max. Permissible Forward Current IF = f (TA)
Forward Current IF = f (VF)
IF
102 mA 101
OHF00143
Threshold Current Ith = f (T)
4.0 Ith mA 3.5 3.0 2.5 2.0
OHF00145
100
10
-1
1.5 1.0 0.5
10-2
10-3
0
0.5
1
1.5
2 V 2.5
0
0
20
40
60
80 C 100
VF
Radiation characteristics rel = f ()
40 30 20
TA
IF =10mA
OHF00144
10
0 1.0
Collector Current IC = f (IF), d = 5 mm, Kodak 90%
1.2 I C;rel 1.0 0.8 0.6 0.4 0.2 0.0
50 0.8 60 0.6
70
0.4
80 90
0.2 0
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
0
5
mA IF
10
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Mazeichnung Package Outlines
6.2 (0.244)
0...0.1 (0...0.004)
0.2 M A
0.15 (0.006) 0.13 (0.005)
(0.05 (0.002) typ.)
5.8 (0.228) 3.4 (0.134) 3.0 (0.118)
(5)
4.2 (0.165) 3.8 (0.150)
B
A
(1.2 (0.047) typ.)
0.5 (0.020) 0.3 (0.012)
(0.47 (0.019) typ.)
1 2 3 6 5 4
Chip Positionen 0.1 M B Empfanger/Receiver
GPLY0505
Type SFH 9210
1 Anode
2 -
3 Emitter
(0.1 (0.004) typ.)
Sender/Emitter
1.27 (0.050) Raster (spacing)
4 Collector
2.54 (0.100) Raster (spacing)
5 -
6 Cathode
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2.1 (0.083) 1.7 (0.067)
SFH 9210
Empfohlenes Lotpaddesign Recommended Solder Pad IR-Reflow Loten IR Reflow Soldering
1.27 (0.050)
0.6 (0.024)
1.2 (0.047)
Padgeometrie fur verbesserte Warmeableitung Paddesign for improved Heat dissipation
1.27 (0.050)
Cu-Flache >5 mm 2 Cu-area >5 mm 2 Lotstopplack Solder resist
3.9 (0.154)
OHPY0030
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
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SFH 9210
Lothinweise Soldering Conditions Bauform Type Drypack Tauch-, Schwalllotung Reflowlotung Level acc. Dip, Wave Soldering Reflow Soldering to Peak Temp. Max. Time in Peak Temp. Max. Time IPS-stand. (solderbath) Peak Zone (package in Peak 020 temp.) Zone 4 n. a. - 260 C 20 sec. Kolbenlotung Iron Soldering (Iron temp.)
SFH 9210
n.a.
Bitte Verarbeitungshinweise fur SMT-Bauelemente beachten! Please observe the handling guidelines for SMT devices!
Lotbedingungen Soldering Conditions IR-Reflow Lotprofil fur bleifreies Loten IR Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 4 Preconditioning acc. to JEDEC Level 4 (nach J-STD-020B) (acc. to J-STD-020B)
300 C 255 C 240 C 217 C 200
OHLA0687
T 250
Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile
C 260 C +0C -5 245 C 5 C C 235 C +5C -0
10 s min 30 s max
150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 100 s max
Ramp Down 6 K/s (max)
50
250
s
300
t
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SFH 9210
Gurtung / Polaritat und Lage siehe Dokument: Short Form Katalog: Gurtung und Verpackung - SMT-Bauelemente - Gehause:SMT RLS Methode of Taping / Polarity and Orientation see document: Short Form Catalog: Tape and Reel SMT-Components - Package: SMT-RLS
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered 2005-02-18 10

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